Parmi SPI HS70

SPI HS70 Series is the next generation fastest in-line Solder paste inspection system in the market. The measuring speed is 100cm2/sec at 13x13um resolution, and 80cm2/sec at 10x10um resolution. It can inspect smaller than 01005 pads and sizes as small as 100um. The HS70 inspection cycle time has been greatly reduced based on PARMI’s development of the RSC-6 sensor. Furthermore, there are two kinds of magnification of Camera Lens for the RSC Sensor delivering – 0.42x to 0.6x magnifications providing more control to the engineer.

spi_hs70-tHS 70 series platforms & mountable panel spec.

  • SPI HS70 : 420x350mm, thickness 4mm, weight 4kg
  • SPI HS70L : 590x610mm, thickness 10mm, weight 10kg
  • SPI HS70D : 340x315mm, thickness 4mm, weight 4kg

Key features of 3D sensor “RSC VI”

  • Best speed at best resolution
    • 100㎠/sec @ 13x13um spatial resolution with RSC VI
    • 80㎠/sec @ 10x10um spatial resolution with RSC VI
  • Shadow free by dual laser projection
  • Real time PCB warp tracking & Warp measuring
  • Real 3D shape & color 2D image

Stable operation & long life time
The PARMI laser head is mounted onto linear motors which gives smooth continuous motion and provides more stability in eliminating the effect vibration can have on accurate measuring of height, area, volume and warp. This is in contrast to other systems on the market which use stepper motors and a “Stop/Go” motion function which causes vibration and inaccurate results due to the quick acceleration and quick braking of the table. The PARMI linear motor life time is longer also due to the stable motion of the laser head.


Easy maintenance
All electrical and electronic controls parts are located inside the easy access front sliding cabinet.
Maintenance access to parts is easy and quick, which is especially important in in-line condition.

Flexible dual lane conveyor
The Dual Lane conveyor of SPI HS70D has adjustable 2nd, 3rd, and 4th rails. 1st and 3rd rails or 1st, and 4th rails can be alternatively selected. A “Down clamping” mechanism is used for immaculate PCB loading. The Down-Clamping mechanism makes the PCB loading condition stable and settled.

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